Methods of fabrication of wafer-level vacuum packaged devices

摘要

An hermetic, gas filled or vacuum package device and method of making a vacuum package device. The device includes a device layer (22) having one or more Micro Electro-Mechanical Systems (MEMS) devices. The device layer includes one or more electrical leads coupled to the one or more MEMS devices. The device also includes a first wafer (30) having one or more silicon pins (32), wherein a first surface of the first wafer is bonded to a first surface of the device layer in such a manner that the one or more silicon pins are in electrical communication with the electrical leads. A second wafer (40), which may also have one or more silicon pins, is bonded to a second surface of the device layer. The first and second wafers are formed of borosilicate glass and the device layer is formed of silicon.