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Method for measuring point defect distribution of silicon single crystal lingot

机译:单晶硅单晶硅片的点缺陷分布的测量方法

摘要

A single crystal ingot is cut to an axial direction so as to including the central axis, a sample for measurement including regions [V], [Pv], [Pi] and [I] is prepared, and a first sample and second sample are prepared by dividing the sample into two so as to be asymmetrical against the central axis. A first transition metal is metal-stained on the surface of the first sample and a second transition metal different from the first transition metal is metal-stained on the surface of the second sample. The first and second samples stained with the metals are thermally treated and the first and second transition metals are diffused into the inside of the samples. Recombination lifetimes in the whole of the first and second samples are respectively measured, and the vertical measurement of the first sample is overlapped on the vertical measurement of the second sample. The boundary between the regions [Pi] and [I] and the boundary between the regions [V] and [Pv] are respectively specified from the overlapped result.
机译:沿轴向切割单晶锭以使其包括中心轴,制备包括区域[V],[Pv],[Pi]和[I]的测量用样品,并且制备第一样品和第二样品。通过将样品一分为二而制备成相对于中心轴不对称。第一过渡金属在第一样品的表面上被金属染色,并且与第一过渡金属不同的第二过渡金属在第二样品的表面上被金属染色。对被金属污染的第一和第二样品进行热处理,并将第一和第二过渡金属扩散到样品内部。分别测量整个第一样品和第二样品中的重组寿命,并且第一样品的垂直测量与第二样品的垂直测量重叠。从重叠结果分别确定区域Pi和[I]之间的边界以及区域[V]和[Pv]之间的边界。

著录项

  • 公开/公告号EP2077346B1

    专利类型

  • 公开/公告日2012-09-26

    原文格式PDF

  • 申请/专利权人 SUMCO CORPORATION;

    申请/专利号EP20090001440

  • 发明设计人 KURITA KAZUNARI;FURUKAWA JUN;

    申请日2003-10-17

  • 分类号C30B29/06;G01N27/04;

  • 国家 EP

  • 入库时间 2022-08-21 17:16:37

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