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SOI LATERAL MOSFET DEVICE AND INTEGRATED CIRCUIT THEREOF

机译:SOI横向MOSFET器件及其集成电路

摘要

A silicon-on-insulator (SOI) lateral MOSFET device and the integrated circuit thereof are provided. In said device, an active layer (3) includes a body region (9) and a drain region (12) which are located on the surface of the active layer (3) respectively and are separated from each other, and also a planar gate channel region (14'), a source region (11a), a body contact region (10) and a source region (11b) which are located on the surface of the body region (9) and are set in sequence from the side adjacent to the drain region (12). The active layer (3) located between the body region (9) and the drain region (12) is a drift region, wherein the drift region and the body region (9) have opposite conduction types. A semiconductor buried layer (4) is set beneath the surface of the active layer (3), wherein the semiconductor buried layer (4) and the body region (9) have the same conduction type. Said device has a trench gate structure (8) and a planar gate structure (8'), wherein the trench gate structure (8) contacts with the body region (9) and longitudinally extends from the surface of the active layer (3) to a dielectric buried layer (2), and the planar gate structure (8') is formed above the body region (9). Said device has the advantages of high withstand voltage, low specific on-resistance, low power consumption, low cost, and easy miniaturization and integration.
机译:提供了绝缘体上硅(SOI)横向MOSFET器件及其集成电路。在所述器件中,有源层(3)包括分别位于有源层(3)的表面上并且彼此分离的主体区(9)和漏极区(12),以及平面栅极。沟道区(14'),源极区(11a),体接触区(10)和源极区(11b)位于体区(9)的表面上,并从相邻侧开始依次设置到漏区(12)。位于主体区(9)和漏极区(12)之间的有源层(3)是漂移区,其中,漂移区和主体区(9)具有相反的导电类型。半导体掩埋层(4)设置在有源层(3)的表面下方,其中半导体掩埋层(4)和主体区域(9)具有相同的导电类型。所述器件具有沟槽栅极结构(8)和平面栅极结构(8'),其中沟槽栅极结构(8)与主体区域(9)接触并从有源层(3)的表面纵向延伸至介电掩埋层(2),并且在主体区(9)上方形成平面栅极结构(8')。该装置具有耐压高,比导通电阻低,功耗低,成本低,易于小型化和集成化的优点。

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