SEMICONDUCTOR DEVICE WHICH INCLUDES A NEW COMPONENT ASSEMBLING STRUCTURE CAPABLE OF SIMPLIFYING AN ASSEMBLING PROCESS

摘要

PURPOSE: A semiconductor device which includes a new component assembling structure is provided to not use a separate spacer when assembling semiconductor device components, thereby preventing the contraction of a solder bump due to surface tension.;CONSTITUTION: A combining part(130) is arranged between a substrate and a semiconductor chip. The combining part provides easier fine pitch adjustment between the semiconductor chip and substrate. A first bonding member(132) of a stud bump shape is arranged on the substrate. A second bonding member(131) of a piercing bump shape is arranged on the semiconductor chip. A tail part is arranged as a point end part in the piercing bump.;COPYRIGHT KIPO 2012