The present invention relates to a method of manufacturing a diamond wire for processing semiconductor materials and a diamond wire produced through the same, wherein a UV curing agent is applied to the surface of the wire, diamond particles are attached to the surface of the wire to which the UV curing agent is applied, and then the UV curing agent By manufacturing the diamond wire in a way to harden, it is possible to minimize the contamination of the cutting material and equipment due to the conventional slurry, and to solve the problem of processing the waste slurry, and in particular, to increase the adhesion strength by preventing the diamond particles from leaving. Therefore, it can contribute to the improvement of the performance of the entire diamond wire, as well as has an effect of making the service life longer. ; Semiconductor, cutting, processing, wire, diamond, hardener, UV, IR
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