METHOD FOR FABRICATING SUBSTRATELESS SEMICONDUCTOR CHIP PACKAGE AND SUBSTRATELESS SEMICONDUCTOR CHIP PACKAGE FABRICATED USING THEREOF

摘要

PURPOSE: A fabricating semiconductor chip package manufacturing method and manufactured fabricating semiconductor chip package using the same are provided to use detachable 3-layered copper foil as a carrier substrate capable of detaching in final step instead of an organic substrate, thereby enabling to prevent a printed circuit substrate bending problem during a package process and possible damage on the semiconductor chip. CONSTITUTION: A first electrode plate layer and circuit layer connected to the first electrode plate layer are formed on the upper part of a carrier substrate. A second electrode plate layer(170) is formed on the upper part of the circuit layer. A circuit bonding pad layer is formed on the upper part of the second electrode plate layer. A semiconductor chip(200) including a die bonding pad layer in the upper part is formed with separation on the upper part of the circuit layer. The die bonding pad layer(220) and circuit bonding pad layer(180) are connected using a bonding wire(190). A package layer(230) protecting the semiconductor chip and circuit layer is formed on the upper part of the carrier substrate. The lower part of the circuit layer is exposed by eliminating the carrier substrate. An insulating layer is formed on the bottom surface of the exposed circuit layer. The lower part of the circuit layer is exposed by eliminating the first electrode plate layer. A surface processing layer(250) is formed on the lower part of the circuit layer(160). A solder ball(260) is formed in the lower part of the surface processing layer.