A universal adapter for testing socket of BGA package

摘要

The utility model relates to a universal adaptor for a BGA packaging testing socket. Particularly, the universal adaptor is irrelevant to the size of shells of various types of BGA packaging memories, or the arrangement of welding spots; any BGA packaging can be installed for testing, therefore, parts do not need to be replaced according to various packagings; and a slider and the adaptor are integrated, thus minimizing the assembling process, and improving the stability of a connecting point between the welding spot and a contact pin. Aiming at solving the technical problems, the universal adaptor for the BGA packaging testing socket can be assembled at the upper part of a square fixing body forming the BGA packaging testing socket in a planar sliding way, and the assembly and disassembly of the BGA packing are conducted on the universal adaptor. The universal adaptor is characterized by comprising a sliding part and a welding spot installation part, wherein the sliding part can be assembled at the upper part of the square fixing body in a planar sliding way, and comprises a plurality of through crack grooves communicated vertically at equal intervals in the slant line direction and a plurality of partition walls arranged at the inner sides of the through crack grooves at equal intervals and integrally formed; the welding spot installation part is integrally arranged at one part of the upper surface of the sliding part in a protruding way and comprises a plurality of extending crack grooves formed by extending toward the communication direction of the through crack grooves and ball-shaped grooves formed at each corresponding position of the extending crack grooves corresponding to the partition walls.