ELECTROLESS PLATING DEVICE, WHICH CAN ENTIRELY PLATE THE INSIDE SURFACE OF THE ELEMENTS HAVING THROUGH HOLES

摘要

PURPOSE: An electroless plating device is provided to prevent the corrosion of the elements inner surface by plating the entire inside surface of the elements having through holes.;CONSTITUTION: An electroless plating device comprises a plating solution storing unit(2), first and second connecting members(5,6), a conveying unit(3), and a first temperature control unit(4). The plating solution storing unit having a through hole stores the plating liquid for plating the inner surface of the element. The first concatenated member is connected to one end of the part to be communicated with the through hole. The second connecting member is connected to the other end of the part to be communicated in the through hole. The first temperature control unit controls the temperature of the plating liquid which passes through the through hole in order to plate the inner surface of the elements.;COPYRIGHT KIPO 2012