DEVICE FOR PLATING INSIDE SURFACE OF CAVITY HOLE AND METHOD FOR PLATING INSIDE SURFACE OF CAVITY HOLE

摘要

PROBLEM TO BE SOLVED: To provide a device for plating the inside surface a cavity hole capable of making a contribution to an improvement in stirring efficiency to an anode body and an improvement in plating efficiency. ;SOLUTION: The anode body 3 arranged in the cavity hole 70 of an object 7 to be plated and a stirring vane member 4 arranged rotatably between the inside surface 72 of the cavity hole 70 of the object 7 to be plated and the anode body 3 are used. The stirring vane member 4 rotates separately from the anode body 3. The stirring vane member 4 is rotated by imparting a relative rotational speed difference between the stirring vane member 4 and the anode body 3, by which the inside surface 72 of the cavity hole 70 of the object 7 to be plated is subjected to a plating treatment while the plating liquid W is kept stirred.;COPYRIGHT: (C)1997,JPO