SEMICONDUCTOR MP WAFER PROCESS CAPABLE OF REDUCING TIME AND COSTS OF CHECKING AN IC DESIGN WINDOW

摘要

PURPOSE: A semiconductor MP wafer process is provided to reduce manufacturing costs and improve functional integration by connecting heterogeneous semiconductor process technology or mixed-mode IC design.;CONSTITUTION: An MP wafer(100) includes a plurality of MP chips(101). An MP mask set(400) includes a plurality of masks(4A,4B,4C,4D,4E,4F,4F') to form various device components with different levels. IC patterning information includes a semiconductor device source/drain forming pattern, a mutual connection forming pattern or a via hole forming pattern. A link process is a wire bonding process, a mutual connection unit bumping process or a silicon through electrode process.;COPYRIGHT KIPO 2012