ADHESIVE MASKING TAPE FOR A MOLDED UNDERFILL PROCESS FOR DIE EXPOSED FLIP-CHIP PACKAGE

摘要

PURPOSE: An adhesive masking tape for a molded underfill process for die exposed flip-chip package is provided to prevent contamination by including an energy ray curable type urethane resin of 5 to 30 parts by weight based on an acrylic resin of 100 parts by weight.;CONSTITUTION: An adhesive masking tape is composed of a heat resistant material(A3) and an adhesion layer(A4). The adhesion layer is applied on the heat resistant material. The heat resistant material is a polymer resin having heat resistance at approximately 180C of a MUF(Molded Underfill) processing temperature. The adhesion layer includes an acrylic resin, a thermosetting material, an energy ray curable type oligomer resin, and a photo initiator and is hardened by thermosetting and energy rays.;COPYRIGHT KIPO 2012