首页>
外国专利>
METHOD FOR PICKING UP A DIE BONDER AND THE DIE BONDER CAPABLE OF SEPARATING A DIE
METHOD FOR PICKING UP A DIE BONDER AND THE DIE BONDER CAPABLE OF SEPARATING A DIE
展开▼
机译:芯片键合的拾取方法及可分离芯片的键合键合
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: A method for picking up a die bonder and the die bonder are provided to improve the stability of a pickup process by constantly maintaining tension to suppressing separation deviation due to a lift.;CONSTITUTION: A collet part(40) includes a collet(42) and a collet holder(41) which supports the collet. Inhalation holes(41v,42v) are formed on the collet part to absorb a die(4). A lifting unit(50) includes a driving unit which drives a start point forming pin part and a dome body(58). The driving unit includes a driving shaft(57) and an operator(53) which vertically moves. A dome head(58b) with an absorption hole(58a) is located on the upper side of the dome body.;COPYRIGHT KIPO 2013
展开▼