METHOD OF ELECTROPLATING COPPER OVER A PATTERNED DIELECTRIC LAYER TO ENHANCE PROCESS UNIFORMITY OF A SUBSEQUENT CMP PROCESS

摘要

In the new metal plating method onto the dielectric layer comprising a small diameter vias with larger diameter trench 205, the surface roughness, for example, of the leveler in at least the plating solution on the non-patterned region 206 of the dielectric 203 It is produced by reducing the amount, thereby improving the uniformity of the material removed in a subsequent chemical mechanical polishing (CMP) process. ; The electrolytic cell, the polishing, the surface roughness, patterning, a dielectric layer.