Copper clad laminate, surface treated copper foil used for manufacturing the same, and printed wiring board manufactured using the same

摘要

The invention provides a flexible printed circuit board that avoids phenomenon of over etching on bottom of a wiring circuit even if etching solution containing sulfuric acid and hydrogen peroxide is used for processing, and a copper foil that can stop the phenomenon. In order to realize the purpose, a copper-clad laminate with the following characteristics is adopted: interface between a copper layer and an insulating resin layer of the copper-clad laminate for manufacturing the printed circuit board made by attaching the copper layer and the insulating resin layer is provided with a surfacetreating layer; the surface treating layer contains zinc ingredient and transient metal ingredients that can take ionic valence within three kinds except for zinc, and surface roughness of the surface between the copper layer and the insulating resin layer is below 2.5 Mu m. In addition, the surface treating copper foil is adopted in producing the copper-clad laminate, and surface of the copper foil 2 of the surface treating copper foil is provided with a surface treating layer, the surface treating layer contains zinc ingredient and transient metal ingredients that can take ionic valence within three kinds except for zinc, and surface roughness is below 2.5 Mu m.