Treated copper foil, copper-clad laminate, a printed wiring board, electronic apparatus, a method of manufacturing a semiconductor package, a printed wiring board, method of manufacturing the electronic device, method of manufacturing a semiconductor package, a method of manufacturing a resin substrate, a copper foil method of transferring the surface profile in the resin base material

摘要

PROBLEM TO BE SOLVED: To provide surface-treated copper foil which allows removal of copper foil at reasonable costs without the need of etching in removing copper foil from a resin substrate after sticking of the resin substrate to the copper foil or impairment of the profile of the surface of the copper foil transferred to the surface of the resin substrate.SOLUTION: Surface-treated copper foil includes copper foil which is free of roughened particles and has a surface irregularities Rz of 0.1-5.0 m and a release layer which is provided on the surface of the copper foil having surface irregularities and makes a resin substrate peelable when a resin substrate is stuck to the copper foil from the side of the release layer. The release layer is composed of one or a combination of aluminate compounds of the following formula, hydrolysis products of the compounds and condensation products of the hydrolysis products.