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Semiconductor nanoheterostructures InAlAs / InGaAs With METAMORFORNYM BUFFER

机译:METAMORFORNYM BUFFER的半导体纳米异质结构InAlAs / InGaAs

摘要

The invention relates to a semiconductor MNEMT (metamorphic high electron mobility transistor) nanogeterostruktur used to manufacture transistors and microwave monolithic integrated circuits with high operating frequency and high breakdown voltages.; Object of the present utility model is to increase the operating frequency of the microwave transistors fabricated on the basis nanogeterostruktur high InAs in an active region grown on GaAs substrates. The technical result, which allows to execute a task, is to reduce the density of dislocations penetrating into the active region nanoheterostructures.; Technical result is achieved due to the fact that in the semiconductor nanogeterostruktur metamorphic InAlAs / InGaAs (2) consisting of a monocrystalline semi-insulating substrate is GaAs (1) superlattice AlGaAs / GaAs (2), a buffer layer GaAs (3), metamorphic buffer In x Al 1-x As (4) the thickness of 1.0 ÷ 1.5 micron with a linear increase InAs x content x in thickness from 1 to x 4, where x 1 = 0, x 4 ≥0.75, depletion region In x Al 1-x As (5) with gradual reduction InAs x content in thickness from 4 x 4 to x 'where x 4 -x 4' = 0.03 ÷ 0.08, heal with a uniform layer of the composition In x4 'Al1-x4' As (6), the active region of InAlAs / InGaAs (7) with a high holding InAs (70%) agreed on the lattice parameter with heals layer inside metamorphic buffer (4) at equal distances from each other and from the buffer boundaries introduces two inverse layers (9 and 12) with a smooth decrease InAs x content across the thickness at Δx = 0.03 ÷ 0.06, each of which must be healed layer (10 and 13) with a composition matching the composition of the final inversion layer.
机译:本发明涉及一种用于制造具有高工作频率和高击穿电压的晶体管和微波单片集成电路的半导体MNEMT(变质高电子迁移率晶体管)纳米结构。本实用新型的目的是提高在GaAs衬底上生长的有源区中基于纳米结构的高InAs制造的微波晶体管的工作频率。允许执行任务的技术结果是降低渗透到有源区纳米异质结构中的位错的密度。由于在由单晶半绝缘衬底组成的半导体纳米结构的变质InAlAs / InGaAs(2)中是GaAs(1)超晶格AlGaAs / GaAs(2),缓冲层GaAs(3)变质这一事实而获得技术成果在 x Al 1-x As中缓冲(4)的厚度为1.0÷1.5微米,InAs x含量x的线性增加是从 1 到x 4,,其中x 1 = 0,x 4 ≥0.75,耗尽区在 x Al < Sub> 1-x As(5),InAs x的含量从 4 x 4 逐渐减小到x',其中x 4 -x 4' = 0.03÷0.08,用均匀组成的 x4'Al 1-x4' As( 6),具有高保持InAs(70%)的InAlAs / InGaAs(7)的有源区,在晶格参数上达成一致,并在变质缓冲区(4)内的修复层彼此之间以及与缓冲区边界之间的距离相等两个反层(9和12)在整个厚度上InAs x含量在Δx= 0.03÷0.06时具有平滑的降低,其中每个反光层(10和13)的愈合层的组成必须与最终反型层的组成相匹配。

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