Method for material removal processing of sides of semiconductor wafers in e.g. microelectronics, involves bringing side of wafer in contact with sandpaper, so that material removal from side of wafer is caused in processing step

摘要

The method involves bringing a side of a semiconductor wafer in contact with a sandpaper, so that material removal from a side of the semiconductor wafer is caused in a processing step. The semiconductor wafer is turned, and another side of the semiconductor wafer is brought in contact with the sandpaper, so that material removal from another side of the semiconductor wafer is caused in another processing step. Friction forces exerted on the semiconductor wafer or a rotor disk by different layers are reduced by adding viscous media e.g. hydraulic colloid, polyose or polyol.