Method for producing a press-fit diode and press-fit diode

摘要

The invention relates to a method for producing a press-in diode which has a base, a head wire and a semiconductor chip soldered between the base and the head wire. First, a semiconductor chip is provided, on the top and bottom of which a lead-free alloy with a low melting point is deposited. The semiconductor chip is then connected to the base and the head wire by means of diffusion soldering. Furthermore, the press-in diode preferably has elastically and / or plastically deformable functional layers that prevent damage to the semiconductor chip and the solder caused by temperature differences during operation.