Method for manufacturing a press-fit diode and press-fit diode

摘要

The method involves soldering semiconductor chip (3) between the base (1) and hand wire (6). The semiconductor chip is provided on upper side and lower side of lead-free alloys (4,5) with low melting point. The head wire is connected with base by diffusion bracing. The alloy is a tin copper alloy, tin silver alloy and tin gold alloy. An independent claim is included for insertion diode.