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Semiconductors - package, comprising a substrate - feedthrough (tsv -) has poser interference and method for producing the semiconductor - package
Semiconductors - package, comprising a substrate - feedthrough (tsv -) has poser interference and method for producing the semiconductor - package
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机译:半导体-包括衬底的封装-穿通线(tsv-)具有发射极干涉并且制造该半导体-封装的方法
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摘要
The package (1) has an interposer (120) formed from a semiconductor material or a glass material and comprising pads (124) formed on its upper surface. A lower semiconductor chip (130) is attached at the interposer. An upper semiconductor device (200) has a lower surface on which terminals (270, 280) are formed. The device has conductive bumps with lower and upper sections arranged on the upper surface of the interposer and extending to the lower surface of the device. The bumps connect one of the pads to the corresponding terminal on the lower surface of the device. An independent claim is also included for a method for producing a semiconductor package.
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