WAFER PROCESSING TAPE, WAFER PROCESSING TAPE MANUFACTURING METHOD AND PUNCHING ROTATION BLADE

摘要

PROBLEM TO BE SOLVED: To prevent peeling of an adhesive layer from a self-adhesive layer of a self-adhesive tape.;SOLUTION: A wafer processing tape 1 comprises a peeling film 2, an adhesive layer 3 partially formed on the peeling film 2, and a self-adhesive tape 4, which are laminated. The self-adhesive tape 4 includes a self-adhesive layer 12 formed on a base material film 10. The self-adhesive tape 4 covers the adhesive layer 3 and is formed so as to contact the peeling film 2 at a circumference of the adhesive layer 3. The wafer processing tape 1 further comprises a pressed part 20 at which the self-adhesive tape 4 and the adhesive layer 3 are pressed together and which is provided on the periphery of the adhesive layer 3.;COPYRIGHT: (C)2013,JPO&INPIT