首页> 外国专利> PROCESS MONITORING DEVICE FOR SEMICONDUCTOR MANUFACTURING APPARATUS, PROCESS MONITORING METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR MANUFACTURING APPARATUS

PROCESS MONITORING DEVICE FOR SEMICONDUCTOR MANUFACTURING APPARATUS, PROCESS MONITORING METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR MANUFACTURING APPARATUS

机译:半导体制造装置的过程监视装置,半导体制造装置的过程监视方法,以及半导体制造装置

摘要

PROBLEM TO BE SOLVED: To provide a process monitoring device of a semiconductor manufacturing apparatus and a process monitoring method of the semiconductor manufacturing apparatus, which can monitor the process of the semiconductor manufacturing apparatus more readily and reliably than before, and the semiconductor manufacturing apparatus.SOLUTION: A monitoring device of a semiconductor manufacturing apparatus that monitors the state of a process of the semiconductor manufacturing apparatus that processes a substrate to be processed includes: storage means that stores normal-time moving image data indicating a normal state of the process; imaging means that captures an image of the state of the process to be monitored so as to obtain moving image data; abnormality degree calculation means that extracts a feature quantity for each frame of the moving image data obtained by the imaging means and the normal-time moving image data, and calculates an abnormal degree on the basis of the extracted feature quantity; and display means that displays the abnormal degree calculated by the abnormality degree calculation means in association with the frame position of the moving image data.
机译:解决的问题:提供一种半导体制造装置的过程监视装置以及该半导体制造装置的过程监视方法,其可以比以前更容易且更可靠地监视半导体制造装置的过程以及该半导体制造装置。解决方案:一种半导体制造装置的监视装置,其监视对要处理的基板进行处理的半导体制造装置的处理状态,该存储装置包括:存储装置,其存储指示该处理的正常状态的正常时间运动图像数据;以及存储装置。成像是指捕获要监视的过程状态的图像,以获得运动图像数据;异常度计算单元,针对由摄像单元获得的运动图像数据和通常时的运动图像数据的每一帧,提取特征量,并基于所提取的特征量来计算异常度。显示部件,其与运动图像数据的帧位置相关联地显示由异常度计算部件计算出的异常度。

著录项

  • 公开/公告号JP2013214279A

    专利类型

  • 公开/公告日2013-10-17

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20120273207

  • 申请日2012-12-14

  • 分类号G05B23/02;H01L21/02;

  • 国家 JP

  • 入库时间 2022-08-21 17:02:26

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