The wafer drier and the wafer dry method of using this

摘要

It is to offer the wafer drier which as for purpose of this invention, can be possible, decrease the amount used of the gas to decrease the damage of the wafer, and the wafer dry method of using this. This invention regards the wafer drier and the wafer dry method of using this. As for the particular device, the 1st axis of rotation is locked by the side, the 1st nozzle and the above-mentioned 2nd axis of rotation which supply the IPA/nitrogen gas to the tilt arm and the above-mentioned cassette where the cassette where the portable possible 2nd axis of rotation is formed by top, is locked by the chamber and the above-mentioned 1st axis of rotation and the above-mentioned 2nd axis of rotation where the 1st scupper is formed to lower part, mounts the wafer is locked to the end 1st direction or the drive motor which turns the screw and the above-mentioned screw which are made to move to 2nd direction and,It has. Selective figure Figure 1