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International symposium on ultra clean processing of semiconductor surfaces

召开年：2014
召开地：Brussels(BE)
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1.Necessity of Cleaning and its Application in Future Memory Devices

机译：清洁的必要性及其在未来存储设备中的应用
- 作者：Geunmin Choi
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- cleaning;
- chemical fume;
- FOUP purging;
- cluster system;
- human safety;
- leaning-free;
2.Removal of Interfacial Layer in HfO_2 Gate Stack by Post-Gate Cleaning Using NF_3/NH_3 Dry Cleaning Technique

机译：使用NF_3 / NH_3干洗技术进行后门清洗，去除HfO_2栅堆叠中的界面层
- 作者：Min Seon Lee;Hoon Jung Oh;Joo Hee Lee;In Geun Lee;Woo Gon Shin;Sung Yong Kang;Dae Hong Ko
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- HfO_2;
- Post-gate cleaning;
- Dry cleaning;
- NF_3/NH_3 plasma;
3.Catalyst assisted low temperature pre epitaxial cleaning for Si and SiGe surfaces

机译：用于Si和SiGe表面的催化剂辅助低温预外延清洁
- 作者：Sathish Kumar Dhayalan;Andriy Hikavyy;Roger Loo;Kurt Wostyn;Karine Kenis;Yosuke Shimura;Erik Rosseel;Harald Profijt;Jan Willem Maes;Bastien Douhard;Wilfried Vandervorst
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Pre-epi-clean;
- Cool clean;
- SiGe clean;
- GeH_4/HCI clean;
- catalyst assisted clean;
4.HF-last wet clean in combination with a low temperature GeH_4-assisted HCI in-situ clean prior to Si_(0.8)Ge_(0.2)-on-Si epitaxial growth

机译：在Si_（0.8）Ge_（0.2）-on-Si外延生长之前，先进行HF-最后湿法清洗并结合低温GeH_4辅助HCl原位清洗
- 作者：Kurt Wostyn;Sathish K. Dhayalan;Andriy Hikavyy;Roger Loo;Bastien Douhard;Alain Moussa;Dirk Rondas;Karine Kenis;Paul W. Mertens;Frank Holsteyns;Stefan De Gendt;Harald B. Profijt
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- pre-epi clean;
- HF last;
- in-situ clean;
- cool clean;
5.Retardation Phenomenon of Oxide Removal during the Formation of Dual Gate Oxide via PR-mask Wet Etching

机译：PR掩膜湿法刻蚀形成双栅氧化物时的迟滞现象
- 作者：Kihvung Ko;Myung-Geun Song;Byung Kwon Cho;Bo Un Yoon;Yu Jin Cho;Tae Sung Kim
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Dual Gate oxide;
- PR-mask wet etching;
- oxide residue;
- ozonated DIW treatment;
6.Aluminum Reduction in SC1

机译：SC1中的铝减少
- 作者：Sasha J. Kweskin;Larry W. Shive
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- RCA;
- SC1;
- metal contamination;
- ion exchange;
- silica;
- quartz;
7.Metal removal efficiency in deep submicron trenches by wet chemicals

机译：湿化学物质去除深亚微米沟槽中的金属的效率
- 作者：Philippe Gamier;Nathalie Drogue;Romain Duru
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- metal removal efficiency;
- deep trench;
- photo luminescence;
- surface photo voltage;
- VPD ICPMS;
8.Impact of surface treatment of Si_3N_4 on subsequent SiO_2 deposition

机译：Si_3N_4的表面处理对后续SiO_2沉积的影响
- 作者：Francesca Milanesi;Silvio Vendrame;Enrica Ravizza;Simona Spadoni;Francesco Pipia;Luisito Livellara
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- SiN;
- wet cleanings;
- SAUSG;
- SiO2;
- STI;
- filling;
9.Operation of a new electrolyzed cell using Boron Doped Diamond electrodes

机译：使用掺硼金刚石电极的新型电解槽的运行
- 作者：Dr. M. Fryda;Dr. Th. Mathee;Dr. J. Oshinowo;D. H. Baek;Dr. H.-J. Foerster;G. Heinze
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Electrolyzed water;
- Cathode water;
- Anode water;
- Boron Doped Diamond cells;
- Redox potential;
- pH-value;
- ESA;
- SPM;
- SC1;
- SC2;
- Ozonized water;
- Hydrogenated water;
10.InGaAs (110) surface cleaning using atomic hydrogen

机译：使用原子氢的InGaAs（110）表面清洁
- 作者：Tyler Kent;Mary Edmonds;Ravi Droopad;Andrew C. Kummel
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- InGaAs (110) surface;
- atomic hydrogen;
- native oxide removal;
- scanning tunneling microscopy;
11.Surface Chemistry of GaAs(100) and lnAs(100) Etching with Tartaric Acid

机译：酒石酸刻蚀GaAs（100）和lnAs（100）的表面化学
- 作者：Pablo Mancheno-Posso;Anthony J. Muscat
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
12.Nanoscale etching and reoxidation of InAs

机译：InAs的纳米级蚀刻和再氧化
- 作者：D.H. van Dorp;S. Arnauts;D. Cuypers;J. Rip;F. Holsteyns;S. De Gendt
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- InAs;
- etching;
- reoxidation;
- cleaning;
- Ⅲ-V channel;
- fin-FET;
13.Passivation of lnSb(100) with 1-eicosanethiol self-assembled monolayers

机译：1-二十烷硫醇自组装单层对lnSb（100）的钝化
- 作者：Yissel Contreras;Anthony J. Muscat
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
14.Cross-Contamination Risk Evaluation during Fabrication of Ⅲ-V Devices in a Silicon Processing Environment

机译：硅加工环境中制造Ⅲ-V器件时的交叉污染风险评估
- 作者：Marie-Christine Roure;Sylvain Vialle;Mickaeel Rebaud;Herve Fontaine;Pascal Besson
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- cross-contamination risk;
- metallic contamination;
- Ⅲ-V etching and cleaning;
- Gallium arsenide;
- Indium phosphide;
15.Surface cleaning of graphene by CO_2 cluster

机译：CO_2簇对石墨烯的表面清洁
- 作者：Hoomi Choi;Jang Ah Kim;Yujin Cho;Taehyun Hwang;Jonwoo Lee;Taesung Kim
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Graphene;
- Residue;
- CO_2 cluster;
- Cleaning;
- Surface treatment;
16.Process Control Challenges of Wet Etching Large MEMS Si Cavities

机译：湿蚀刻大型MEMS Si腔的过程控制挑战
- 作者：Ismail Kashkoush;Jennifer Rieker;Gim Chen;Dennis Nemeth
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- anisotropic silicon etching;
- TMAH;
- concentration control;
- flow dynamics;
- CFD;
- MEMS;
17.Wet etch rate behavior of poly-Si in TMAH solution at various ambient gas conditions

机译：在各种环境气体条件下，TMAH溶液中多晶硅的湿蚀刻速率行为
- 作者：Euing Lin;Ted Guo;C.C. Chien;M.H. Chang;Wesley Yu;N.H. Yang;J. F. Lin;J.Y. Wu;Kenneth M. Robb;Alessandro Baldaro;A.N. Other
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Selectivity etch;
- TMAH;
18.Advanced Monitoring of TMAH Solution

机译：TMAH解决方案的高级监控
- 作者：Jingjing Wang;Eugene Shalyt;Chuannan Bai;Guang Liang;Michael MacEwan;Vishal Parekh
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Photoresist development;
- tetramethyl ammonium hydroxide;
- TMAH;
- carbonate;
- surfactants;
- process control;
- Sigma etching;
19.Effect of Dissolved Oxygen for Advanced Wet Processing

机译：溶解氧对先进湿法处理的影响
- 作者：Yukifumi Yoshida;Masayuki Otsuji;Hiroaki Takahashi;Jim Snow;Farid Sebaai;Holsteyns Frank;Paul W. Mertens;Masanobu Sato;Hajime Shirakawa;Hirofumi Uchida
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Dissolved Oxygen;
- Galvanic Corrosion;
- RMG;
- Etching;
- Ge;
20.Watermark formation on bare silicon: Impact of illumination and substrate doping

机译：裸硅上形成水印：照明和基板掺杂的影响
- 作者：Amir-Hossein Tamaddon;Harold Philipsen;Paul W. Mertens;Frank Holsteyns;Marc Heyns;Stefan De Gendt;Dennis H. van Dorp
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Watermark;
- silicon oxidation;
- illumination;
- doping density;
21.Selective Nitride Etching With Phosphoric and Sulfuric Acid Mixtures Using a Single-Wafer Wet Processor

机译：使用单晶片湿处理器，用磷酸和硫酸混合物进行选择性氮化蚀刻
- 作者：Vincent Sih;Berthold Reimer;Anthony S. Ratkovich;Jeffrey M. Lauerhaas;Jeffery W. Butterbaugh
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- selective etching;
- nitride etching;
- spacer etching;
- single wafer tool;
22.Single wafer selective silicon nitride removal with phosphoric acid and steam

机译：用磷酸和蒸汽去除单晶片选择性氮化硅
- 作者：Ted Guo;Wesley Yu;C.C. Chien;Euing Lin;N.H. Yang;J.F. Lin;J.Y. Wu;Anthony Ratkovich;Don Kahaian;Jeffery W. Butterbaugh;Jeffrey M. Lauerhaas
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Silicon Nitride;
- Selectivity;
- Steam;
- Single Wafer;
- Reclaim;
23.Pt Etching Method At Low Temperature Using Electrolyzed Sulfuric Acid Solution

机译：电解硫酸溶液的低温铂蚀刻方法
- 作者：Yuichi Ogawa;Minoru Uchida;Toru Otsu;Tatsuo Nagai;Hiroshi Morita
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- electrolyzed sulfuric acid;
- NiPt etching;
24.Nickel selective etch for contacts on Ge based devices

机译：锗基器件上触点的镍选择性蚀刻
- 作者：Farid Sebaai;Liesbeth Witters;Frank Holsteyns;Yoshida Yukifumi;Paul W. Mertens;Stefan De Gendt
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Selective etch;
- Ge voids;
- hot HCI;
- low O_2 conditions;
- NiGe loss reduction;
25.Study of wetting of nanostructures using decoration by etching

机译：利用蚀刻装饰润湿纳米结构的研究
- 作者：Guy Vereecke;XiuMei Xu;Els Kesters;Ishan Simms;Kathleen Nafus;Leander Haensel;Tae-Gon Kim;Mark Lismont;Frank Holsteyns;Stefan De Gendt
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- wetting;
- nanostructure;
- ellipsometry;
26.Impact of electrostatic effects on wet etching phenomenon in nanoscale region

机译：静电效应对纳米级湿法刻蚀现象的影响
- 作者：Atsushi Okuyama;Suguru Saito;Yoshiya Hagimoto;Kenji Nishi;Ayuta Suzuki;Takayuki Toshima;Hayato Iwamoto
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- wet etching;
- nanoscale region;
- dHF (dilute hydrofluoric acid solution);
- electric double layer;
- solid-liquid interface;
27.Freeze drying of high aspect ratio structures

机译：高纵横比结构的冷冻干燥
- 作者：Mehul N. Patel;Steve Sirard;Ratchana Limary;Diane Hymes
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Freeze drying;
- wet clean;
- drying;
- high aspect ratio;
- collapse;
- stiction;
- DRAM;
28.Effect of Dl-water dilution and etchant arm movement on spinning type wet etch

机译：去离子水稀释和蚀刻剂臂移动对旋转式湿法蚀刻的影响
- 作者：Huihwan Lee;Dukmin Ahn;Seungtaek Lim;Taesung Kim
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Dl-water dilution;
- Etchant arm movement;
- Etch amount;
- Uniformity;
29.Effect of nozzle distance and fluid flow rate in jet spray wafer cleaning process

机译：喷嘴距离和流体流速在喷射喷涂晶片清洗过程中的影响
- 作者：Kwangmin Seo;Daeheon Kim;Yujin Cho;Taesung Kim
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Jet spray;
- Particle removal efficiency;
30.Effects of chamber pressure on the performance of CO_2 beam cleaning

机译：腔室压力对CO_2束清洗性能的影响
- 作者：Seungho Kim;Joongha Lee;Ho-Young Kim
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Dry cleaning;
- Carbon dioxide solid particles;
- Semiconductor cleaning;
31.Physical chemistry of water droplets in wafer cleaning with low water use

机译：低耗水晶圆清洗中水滴的物理化学
- 作者：Jacques C.J. van der Donck;Jurrian Bakker;Jeroen A. Smeltink;Robin B.J. Kolderweij;Ben C.M.B. van der Zon;Marc H. van Kleef
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Cleaning;
- Low UPW use;
- droplet manipulation;
- contact angle;
32.Metal etch in advanced immersion tank with precision uniformity using agitation and wafer rotation

机译：通过搅拌和晶圆旋转在先进的浸没槽中进行金属蚀刻，具有精确的均匀性
- 作者：Scott Tice;Chan Geun Park
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- metal etch;
- gold etch;
- copper etch;
- within wafer (WIW) etch uniformity;
- wafer to wafer (WTW) etch uniformity;
- bubbled N_2;
- wafer rotation;
- immersion tank;
33.Novel Slurry Injection System for Improved Slurry Flow and Reduced Defects in CMP

机译：新型浆料注入系统可改善CMP中的浆料流量并减少缺陷
- 作者：Ara Philipossian;Len Borucki;Yasa Sampurno;Yun Zhuang
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- CMP;
- slurry injection system;
- COO;
- pad debris;
- foam;
- slurry flow;
- wafer-level defects;
34.Effect of viscoelasticity of PVA brush on friction during post- CMP cleaning: A guideline for nodule configuration

机译：CMP后清洁过程中PVA刷的粘弹性对摩擦的影响：结节配置指南
- 作者：Y. Hara;T. Sanada;A. Fukunaga;H. Hiyama
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Post-CMP Cleaning;
- PVA Brush;
- Friction;
- Viscoelasticity;
- Nodule;
35.Understanding the formation of circular ring defects in post-CMP cleaning

机译：了解CMP后清洁中圆环缺陷的形成
- 作者：Ping Hsu;Roger Luo;Pascal Berar
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- PCMP;
- ring defects;
- pH variation;
- particle aggregation;
36.Particle Measurement with a Liquid-borne Particle Counter: Analytical Figures of Merit

机译：液载粒子计数器进行粒子测量：优点分析图
- 作者：Shi Liu;Bin Liu
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Particles measurement;
- liquid-borne particle counter;
- micro-contamination;
- LPC;
37.Fluid flow and defect density considerations when drying bumped wafers using spin and surface tension gradient methods

机译：使用旋转和表面张力梯度法干燥凸点晶片时的流体流动和缺陷密度注意事项
- 作者：Daniel L. Goodman;Dustin Rabideau;Mani Sobhian
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Advanced packaging;
- bumped wafers;
- copper pillar;
- defect density;
- SRD;
- surface tension gradient;
- microfluidic channels;
- resist strip;
- wafer drying;
38.Characterization of Cavitation in Ultrasonic or Megasonic Irradiated Gas Saturated Solutions Using a Hydrophone

机译：使用水听器表征超声或超音速辐射气体饱和溶液中的空化
- 作者：M. Zhao;R. Balachandran;P. R. Madigappu;P. Yam;C. Zanelli;R. Sierra;M. Keswani
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- hydrophone;
- ultrasonic;
- megasonic;
- wafer cleaning;
- cavitation;
- feature damage;
39.Detection of HO_2·/O_2·~- Radicals Formed in Aqueous Solutions Irradiated with Megasonic Waves using a Cavitation Threshold (CT) Cell Set-up

机译：使用空化阈值（CT）单元检测在超声波照射下的水溶液中形成的HO_2·/ O_2·〜-自由基
- 作者：Zhenxing Han;Bing Wu;Ian Brown;Mark Beck;Srini Raghavan
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Megasonics;
- Hydroperoxyl Radicals;
- CT cell;
- MCLA;
- Chemiluminescence (CL);
40.Photo lithography - Surface preparation interactions

机译：光刻-表面处理相互作用
- 作者：Philippe Gamier
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- photo lithography;
- high dose implantation resist strip;
- photoresist adhesion;
- AFM;
- micro masking;
- watermarks;
- wafer charging;
41.Study of etchants' diffusion into a 248 nm Deep UV photoresist during a wet etch

机译：研究湿蚀刻过程中蚀刻剂向248 nm深紫外光致抗蚀剂的扩散
- 作者：Mathieu Foucaud;Nevine Rochat;Philippe Garnier;Erwine Pargon;Raluca Tiron
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
42.Megasonic Enhanced Photoresist Strip with DiO_3

机译：具有DiO_3的Megasonic增强型光刻胶条
- 作者：Don Dussault;Jens Fittkau;Christiane Gottschalk
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- dissolved ozone;
- Megasonic;
- photoresist stripping;
- cavitation;
- DiO_3;
43.Wetting behavior of plasma etch residue removal solutions on plasma damaged and repaired porous ULK dielectrics

机译：等离子蚀刻残留去除溶液在等离子受损和修复的多孔ULK电介质上的润湿行为
- 作者：Nicole Ahner;Sven Zimmermann;Nicole Koehler;Stephan Krueger;Stefan E. Schulz
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- low-k dielectric;
- wet cleaning;
- residue removal;
- plasma damage;
- silylation;
- wetting;
- surface energy;
44.Effect of downstream plasma treatment on dissolution of fluorocarbon polymer in organic solvents

机译：下游等离子体处理对碳氟聚合物在有机溶剂中溶解的影响
- 作者：Q. T. Le;E. Kesters;J. Devonport;F. Holsteyns;S. De Gendt
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
45.Post etch residue removal and material compatibility in BEOL using formulated chemistries.

机译：使用配制的化学物质在BEOL中去除蚀刻后残留物并实现材料兼容性。
- 作者：E.Kesters;Q. T. Le;D. Yu;M. Shen;S. Braun;A. Klipp;F. Holsteyns
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- SADP;
- post etch residues;
- BEOL;
- aqueous chemistries;
- selectivity;
46.Characterization of Cu-BTA organic complexes on Cu during Cu CMP and post Cu cleaning

机译：Cu CMP过程中和清洗后的Cu上Cu-BTA有机配合物的表征
- 作者：Byoung-Jun Cho;Jin-Goo Park;Shohei Shima;Satomi Hamada
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Cu-BTA complex;
- cupric cuprous oxide;
- contact angle;
- electrochemical impedance spectroscopy;
47.TiN Hard Mask Cleans with SC1 solutions, for 64nm pitch BEOL patterning

机译：TiN硬掩模用SC1解决方案清洗，用于64nm间距BEOL图案
- 作者：L. Broussous;D.Krejcirova;K.Courouble;S.Zoll;A.lwasaki;H.lshikawa;F.Buisine;A.Lamaury;D.Fuard
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- TiN Metal Hard Mask;
- dual patterning;
- SC1 wet clean;
48.Industrial Challenges of TiN Hard Mask Wet removal process for 14nm technology node

机译：用于14nm技术节点的TiN硬掩模湿法去除工艺的工业挑战
- 作者：Akihisa lwasaki;Kristell Courouble;Steven Lippy;Fabrice Buisine;Hidekazu Ishikawa;Emanuel Cooper;Evelyn Kennedy;Stephane Zoll;Lucile Broussous
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- TiN hard mask;
- Wet removal;
- Low-cost;
- Bath life;
- Cu loss;
- TiCOF crystal growth;
- Cu filling;
49.TiN metal hardmask residue removal formulation development for advanced porous low-k and Cu interconnect application

机译：用于先进的多孔低k和Cu互连应用的TiN金属硬掩模残留物去除配方开发
- 作者：Hua Cui
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Metal hardmask;
- etch residues removals;
- sidewall polymer;
- TiN etch;
- Cu/low-k;
50.Prevention of unexpected oxidation of metal layer by removing hydrogen peroxide from ultrapure water and diluted hydrofluoric acid

机译：通过从超纯水和稀氢氟酸中去除过氧化氢来防止金属层意外氧化
- 作者：Daisaku Yano;Masami Murayama;Hikaru Kobayashi;Koji Yamanaka
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- ultrapure water;
- dilute hydrofluoric acid;
- hydrogen peroxide;
- surface conditioning;
- copper;
- molybdenum;
- silicon;
51.Cost-of-ownership comparison of single-wafer processes for stripping copper pillar bump photomasks

机译：剥离铜柱凸点光掩模的单晶圆工艺的拥有成本比较
- 作者：Hongseong Sohn;Tan Kuam Hua;Ding Liang;Steven Lee Hou Jang;Loh Woon Leng;Lin Huamao;John Tracy
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Photoresist stripping;
- chemically amplified photoresist;
- negative tone photoresist;
- megasonics;
- single-wafer;
- bumping process;
- copper pillar;
- micro-bump;
- cost-of-ownership;
52.The role of mass transfer in removal of cross-linked sacrificial layers in 3DI applications

机译：传质在3DI应用中去除交联牺牲层的作用
- 作者：Mani Sobhian;Daniel L. Goodman;Dustin Rabideau;Arthur Keigler
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Negative Resist Strip;
- Advanced Packaging;
- Resist Removal;
- Mass Transfer;
- Boundary Layer;
- Polymer Solvation;
53.Scaling the 3D bumps pitch from 20 to 10 μm, focusing on the wet Cu seed etch process development

机译：将3D凸块的间距从20微米扩展到10微米，重点放在湿法铜种子蚀刻工艺开发上
- 作者：S. Suhard;A. Moussa;J. Slakkeboorn;F. Beirnaert;I de Preter;F. Holsteyns
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- 3D-SIC;
- microbumps;
- Cu seed etch;
- Cu roughness;
54.Adhesion Improvement through Plasma Surface Treatments on Palladium Surface

机译：通过等离子表面处理在钯表面上改善附着力
- 作者：Ivan Venegoni;Matteo Consonni;Irene Bianchi;Enrica Ravizza;Salvatore Grasso;Simona Spadoni;Mario Pistoni;Paolo Colpani
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- surface;
- palladium;
- plasma;
- treatment;
- adhesion;
- passivation;
- oxidation;
- reduction;
55.Control of HF volatile contamination in FOUP environment by advanced polymers and clean gas purge

机译：通过先进的聚合物和清洁气体吹扫控制FOUP环境中的HF挥发性污染物
- 作者：Paola Gonzalez-Aguirre;Herve Fontaine;Carlos Beitia;Jim Ohlsen;Jorgen Lundgren
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- AMC;
- cross-contamination;
- HF;
- polymer materials;
- volatile acids;
56.FOUP material influence on HF contamination during queue-time

机译：排队期间FOUP材料对HF污染的影响
- 作者：Julien Bounouar;Thi-Quynh Nguyen;Olivier Le-Barillec;Arnaud Favre;Emmanuelle Veran;Ingo Stassen;Astrid Gettel
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- AMC;
- HF;
- FOUP;
- contamination;
- cleaning;
- low absorbing material;
- monitoring;
- queue-time;
- outgassing;
- acid;
- desorption;
- adsorption;
57.Effect of FOUP atmosphere control on process wafer integrity in sub20 nm device fabrication

机译：FOUP气氛控制对低于20 nm器件制造中工艺晶圆完整性的影响
- 作者：Bong Ho Kim;Jin-Goo Park
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- N_2 Purge;
- Process queue;
- FOUP;
- Corrosion;
58.Correlation of cleaning conditions and wafer out-gassing

机译：清洁条件和晶圆除气的相关性
- 作者：Sok-Hyung Han;Tae-Ho Hwang;Si-Chul Kim;Seung-Ha Park;Byung-Sul Ryu
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Poly deposition thickness;
- NH_3~+ ion;
- BOE(Buffered Oxide Etchant);
- APM(Ammonium Peroxide Mixture);
- Out-gassing;
59.Quantitative analysis of transition metals penetrating silicon substrate through SiN film by dopant ion implantation and annealing

机译：掺杂离子注入和退火对过渡金属穿过SiN膜穿透硅衬底的定量分析
- 作者：Koichiro Saga;Shunsuke Kobayashi;Koji Sueoka
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Metal contamination;
- Ion implantation;
- SiN film;
- Diffusion;
60.Collection efficiency of noble metallic contaminants on Si wafers with HF-Aqua Regia mixtures for VPD-DC ICPMS analysis

机译：HF-Aqua Regia混合物对硅晶片上贵金属污染物的收集效率，用于VPD-DC ICPMS分析
- 作者：M. Devita;H. Fontaine;N. Drogue;D. Mathiot;V. Enyedi;T. Lardin
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
61.Backside and bevel contamination removal

机译：去除背面和斜面污染物
- 作者：Pascal Besson;Marie-Christine Roure;Riadh Kachtouli;Marine Jourdan;Laurence Gabette;Agnes Royer;Virginie Loup
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- cross-contamination risk;
- metallic contamination;
62.Focus spot reduction by brush scrubber cleaning

机译：通过刷子洗涤器清洁减少焦点
- 作者：Antoine Pacco;Els Kesters;Ihsan Simms;Kathleen Nafus;Jelle Vandereyken;Hiroki Yonekawa
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Scrubber;
- Brush;
- Backside Cleaning;
- Backside Contamination;
- Focus Spots;
- Chuck Spots;
- Hot Spots;
- Overlay;
- Immersion;
- EUV;
63.Upside-down residual sessile droplet: watermarks on wafers backside

机译：倒置的残留无蒂液滴：晶圆背面的水印
- 作者：N.Belmiloud;E.Schaffert;R.Steininger;K.Okamoto;M.Grothe;G.Koerner
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- backside;
- particles;
- watermarks;
- drying;
- single-wafer;
- ozone;
64.Nuclear magnetic resonance spectroscopy of trace organic impurities extracted from a corrosion inhibitor and a semiaqueous residue remover.

机译：从腐蚀抑制剂和半水残留去除剂中提取的痕量有机杂质的核磁共振波谱。
- 作者：Glenn Westwood
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Impurity;
- extraction;
- alkane;
- clean;
65.Improvement of silicon solar cell substrates by wet-chemical oxidation studied by surface photovoltage measurements

机译：通过表面光电压测量研究湿化学氧化对硅太阳能电池基板的改进
- 作者：Heike Angermann;Abdelazize Laades;Jan Kegel;Carola Klimm;Bert Stegemann
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Si surface passivation;
- wet-chemical oxidation;
- SPV;
- Si solar cell substrates;
66.Simplified Cleaning for a-Si:H passivation of wafers bonded to glass

机译：简化清洁粘结到玻璃的晶圆的a-Si：H钝化的过程
- 作者：Stefano N. Granata;T. Bearda;I.Gordon;Y. Abdulraheem;R. Mertens;J. Poortmans
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- Surface Passivation;
- module-level processing;
- silicone;
67.Investigation of silicon saw damage removal and surface texturing using KOH for next generation silicon solar cells

机译：使用KOH的下一代硅太阳能电池的硅锯片损伤消除和表面纹理化研究
- 作者：Michael Haslinger;Jens Rip;Sofie Robert;Martine Claes;Filip Duerinckx;Maarten Debucquoy;Paul Mertens;Joachim John;Damian Pysch;Steffen Queisser;Juergen Schweckendiek;Ali Hajjiad
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- silicon etching;
- saw damage removal;
- silicon surface texturing;
- TXRF;
- minority carrier lifetime;
- emitter saturation current;
68.Impact of Fe and Cu surface contamination on high efficiency solar cell processes

机译：铁和铜表面污染对高效太阳能电池工艺的影响
- 作者：Florian Buchholz;Eckard Wefringhaus
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- solar cells processing;
- p-type;
- n-type;
- Fe and Cu;
- surface contamination;
- diffusion processes;
- passivation processes;
- lifetime studies;
69.Ozone base cleaning: Impact on high efficiency Interdigitated Back Contact solar cells

机译：臭氧层清洁：对高效的交叉指背接触太阳能电池的影响
- 作者：BJ OSullivan;M Haslinger;S Singh;T Bearda;M Debucquoy;J Szlufcik
- 会议名称：《》 | 2015年
- high efficiency solar cell;
- cleaning;
- ozone;
- chemical oxide;
70.Rapid determination of organic contaminations on wafer surfaces

机译：快速测定晶片表面的有机污染物
- 作者：Sylke Meyer;Sebastian Timmel;Christian Hagendorf
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- organic contaminations;
- total organic carbon (TOC);
- surface energy;
- contact angle;
71.Surface cleaning and passivation of chalcogenide thin films using S(NH_4)_2 chemical treatment

机译：S（NH_4）_2化学处理硫属化物薄膜的表面清洁和钝化
- 作者：Marie Buffiere;Abdel-Aziz El Mel;Nick Lenaers;Guy Brammertz;Armin E. Zaghi;Marc Meuris;Jef Poortmans
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年
- thin film solar cells;
- CIGS;
- CZTS;
- secondary phases;
- chemical treatment;
- etching;
- passivation;
72.Preface

机译：前言
- 作者：Paul Mertens
- 会议名称：《International symposium on ultra clean processing of semiconductor surfaces》 | 2015年