SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER MANUFACTURING METHOD, SEMICONDUCTOR WAFER WITH SEMICONDUCTOR ELEMENT MANUFACTURING METHOD AND SEMICONDUCTOR WAFER LAMINATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer with an adhesive layer manufacturing method and a manufacturing method of a semiconductor device using the semiconductor wafer with the adhesive layer, which can reduce voids and minimize warp after grinding.SOLUTION: A semiconductor device manufacturing method comprises the steps of: obtaining a semiconductor wafer 40 with an adhesive layer having a structure of more than one layer and provided with a B-stage adhesive layer containing a flux component on an uppermost surface layer by coating of more than one type of liquid photosensitive adhesive 6, 7 and light irradiation on the coated film, on a circuit surface of a semiconductor wafer 10 having the circuit surface on which metal bumps 12 are formed; and pressure bonding the semiconductor wafer 40 with the adhesive layer and another semiconductor wafer 50 while sandwiching the adhesive layer of the semiconductor wafer 40 with the adhesive layer.