METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER LAMINATED BODY

摘要

Provided is a method for manufacturing a semiconductor device comprising: a step for applying a liquid photosensitive adhesive to the circuit side of a semiconductor wafer having a circuit side in which a metal bump is formed, to form a photosensitive adhesive layer; a step for B-staging the photosensitive adhesive layer by light irradiation to obtain a semiconductor wafer with an adhesive layer; a step for cutting the semiconductor wafer of the semiconductor wafer with the adhesive layer, together with the adhesive layer, into a plurality of semiconductor elements to obtain semiconductor elements with an adhesive layer; and a step for crimping the semiconductor elements with the adhesive layer and other semiconductor elements or the support component for mounting the semiconductor elements across the adhesive layer of the semiconductor elements with the adhesive layer.