HIGHLY RELIABLE WAFER LEVEL PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To improve electric performance of an SAW device and a BAW device.;SOLUTION: One embodiment disclosed includes a package which has an electronic device disposed in a cavity formed by a housing including a sharp portion. The package includes a photosensitive layer applied to the housing, and a smooth portion, which is located adjacent to the sharp portion, may be provided. A manufacturing method of the package is also disclosed. Other embodiments are described and claims may be applied.;COPYRIGHT: (C)2013,JPO&INPIT