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Being production method of the white optical light-emitting diode tip/chip

机译:作为白色光学发光二极管的尖端/芯片的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a white-light light emitting diode (LED) chip and a method of fabricating the same.;SOLUTION: The white-light LED chip 200 includes a blue-light LED chip 201 having a top surface and a bottom surface and a phosphor layer 207 disposed on the top surface of the blue-light LED chip 201 and directly brought into contact with the top surface of the blue-light LED chip 201. The method of fabricating the white-light LED chip 200 provides a plurality of blue-light LED chips 201 attached to a substrate 211, wherein at least one contact pad 203, 205 is formed on the top surface of each blue-light LED chip 201. A protective layer 213 is formed on the contact pad 203. The phosphor layer 207 is formed on the top surface thereof by a molding process, exposing the contact pad 203. Finally, the protective layer 213 and the substrate 211 are removed from the blue-light LED chip 201 to form the white-light LED chip.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种白光发光二极管(LED)芯片及其制造方法。解决方案:白光LED芯片200包括具有顶表面的蓝光LED芯片201和发光二极管芯片201。底表面和设置在蓝光LED芯片201的顶表面上并与蓝光LED芯片201的顶表面直接接触的磷光体层207。白光LED芯片200的制造方法提供了多个蓝光LED芯片201附接到基板211,其中至少一个接触垫203、205形成在每个蓝光LED芯片201的顶表面上。保护层213形成在接触垫203上通过模制工艺在其顶表面上形成磷光体层207,从而暴露出接触垫203。最后,从蓝光LED芯片201去除保护层213和基板211以形成白光LED。芯片;版权:(C)2011,JPO&INPIT

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