Bonding method of the heat conductive silicone composition, method for producing a bonded composite of thermally conductive silicone composition and thermally conductive silicone composition primer for adhesion

摘要

PROBLEM TO BE SOLVED: To provide a method allowing adhesion of a thermally-conductive silicone composition to the gold surface formed on the surface of a silicon wafer, and to provide a primer.;SOLUTION: This method comprises forming gold on the surface of a silicon wafer, applying to the gold surface a primer containing a platinum-based compound, a solvent, and no alkoxysilanes, drying the primer, and then adhering a thermally-conductive silicone composition to the applied surface.;COPYRIGHT: (C)2010,JPO&INPIT