首页> 外国专利> ADHESION METHOD OF THERMAL-CONDUCTIVE SILICONE COMPOSITION, PRIMER FOR ADHESION OF THERMAL-CONDUCTIVE SILICONE COMPOSITION AND PROCESS FOR PRODUCING ADHESIVE COMPOSITE OF THERMAL-CONDUCTIVE SILICONE COMPOSITION

ADHESION METHOD OF THERMAL-CONDUCTIVE SILICONE COMPOSITION, PRIMER FOR ADHESION OF THERMAL-CONDUCTIVE SILICONE COMPOSITION AND PROCESS FOR PRODUCING ADHESIVE COMPOSITE OF THERMAL-CONDUCTIVE SILICONE COMPOSITION

机译:导热硅酮组合物的粘合方法,导热硅酮组合物的粘合底胶和导热硅酮组合物的胶粘剂生产工艺

摘要

An adhesion method for a thermally conductive silicone composition is provided to realize excellent adhesion of a thermally conductive silicone composition to the surface of a noble metal such as gold or silver. An adhesion method for a thermally conductive silicone composition comprises the steps of: applying a primer comprising a platinum group compound and a solvent and free from an alkoxysilane onto the surface of a metal or alloy comprising at least one selected from gold, silver and platinum group(Group 8) elements, followed by drying; and adhering a thermally conductive silicone composition to the resultant surface.
机译:提供一种用于导热硅酮组合物的粘合方法,以实现导热硅酮组合物与贵金属如金或银的表面的优异粘合。导热硅氧烷组合物的粘合方法包括以下步骤:将包含铂族化合物和溶剂且不含烷氧基硅烷的底漆施加到包含选自金,银和铂族中的至少一种的金属或合金的表面上(第8组)元素,然后干燥;将导热的硅氧烷组合物粘附到所得的表面上。

著录项

  • 公开/公告号KR20080038048A

    专利类型

  • 公开/公告日2008-05-02

    原文格式PDF

  • 申请/专利权人 SHIN-ETSU CHEMICAL CO. LTD.;

    申请/专利号KR20070108079

  • 发明设计人 YAMADA KUNIHIRO;MIYOSHI KEI;ENDO AKIHIRO;

    申请日2007-10-26

  • 分类号C09J1/00;C09J183/04;C09J183/00;

  • 国家 KR

  • 入库时间 2022-08-21 19:53:46

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号