首页> 外国专利> THICK FILM SILVER PASTE CONTAINING COPPER AND LEAD-TELLURIUM-OXIDE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES

THICK FILM SILVER PASTE CONTAINING COPPER AND LEAD-TELLURIUM-OXIDE AND ITS USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES

机译:包含铜和氧化钛铅的厚膜银浆及其在半导体设备制造中的用途

摘要

The present invention is directed to a thick film silver paste comprising (i) silver, (ii) copper, and (iii) a Pb—Te—O all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste and a semiconductor device and, in particular, a solar cell comprising such an electrode. The electrodes provide good electrical performance.
机译:本发明涉及一种厚膜银浆,其包括(i)银,(ii)铜和(iii)全部分散在有机介质中的Pb-Te-O。本发明还涉及由糊剂和半导体器件形成的电极,尤其是包括这种电极的太阳能电池。电极具有良好的电性能。

著录项

  • 公开/公告号US2013187101A1

    专利类型

  • 公开/公告日2013-07-25

    原文格式PDF

  • 申请/专利权人 E I DU PONT DE NEMOURS AND COMPANY;

    申请/专利号US201313735602

  • 发明设计人 RAJ G. RAJENDRAN;

    申请日2013-01-07

  • 分类号H01L31/0224;

  • 国家 US

  • 入库时间 2022-08-21 16:51:08

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