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Package integrated soft magnetic film for improvement in on-chip inductor performance
Package integrated soft magnetic film for improvement in on-chip inductor performance
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机译:封装集成软磁膜以改善片上电感器性能
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摘要
An integrated circuit package includes an integrated circuit with one or more on-chip inductors. A package cover covers the integrated circuit. A magnetic material is provided between the integrated circuit and the package cover. The magnetic material may be a soft magnetic thin film. The magnetic material may be affixed to the package cover by an adhesive. The magnetic material may be formed directly on the package cover by one of deposition, sputtering or spraying. The magnetic material may be affixed to the integrated circuit.
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