WAFER-DICING ADHESIVE TAPE AND METHOD OF PRODUCING CHIPS USING THE SAME

摘要

A WAFER-DICING ADHESIVE TAPE, CONTAINING TWO OR MORE REMOVABLE ADHESIVE LAYERS, ON A BASE FILM, THAT HAVE RESIN COMPOSITIONS CONTAINING A RADIATION-POLYMERIZABLE COMPOUND,IN WHICH A CONTENT OF THE RADIATION- POLYMERIZABLE COMPOUND IN THE RESIN COMPOSITION CONSTITUTING AN OUTERMOST REMOVABLE ADHESIVE LAYER IS DIFFERENT FROM THAT OF AN INNER REMOVABLE ADHESIVE LAYER AND A STRESS APPLIED TO THE BASE FILM IS SUFFICIENTLY INTRODUCED TO THE OUTERMOST REMOVABLE ADHESIVE LAYER IRRADIATED WITH RADIATION, SO THAT SAID LAYER CAN BE EASILY PEELED OFF FROM CHIPS CUT; AND A METHOD OF PRODUCING CHIPS USING THE SAME.