SEPARATION MECHANISM FOR ADHESIVE TAPE, SEPARATION APPARATUS FOR ADHESIVE TAPE, SEPARATION METHOD FOR ADHESIVE TAPE, PICKUP APPARATUS FOR SEMICONDUCTOR CHIP, PICKUP METHOD FOR SEMICONDUCTOR CHIP, MANUFACTURING METHOD FOR SEMICONDUCTOR APPARATUS, AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR APPARATUS

摘要

An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at least two adhering areas in the direction in which the adhesive tape is peeled. The porous member adheres to the semiconductor wafer by suction and fixes the wafer in place.