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Method for fabricating an integrated circuit with line-lithography processes and integrated circuit fabricated with line-lithography processes
Method for fabricating an integrated circuit with line-lithography processes and integrated circuit fabricated with line-lithography processes
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机译:用线光刻工艺制造集成电路的方法和用线光刻工艺制造的集成电路
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摘要
A method for fabricating an integrated circuit includes forming a first electrode, forming a heater element coupled to the first electrode, forming a cavity over the heater element whereby the cavity is laterally surrounded by a first dielectric material and a second dielectric material, depositing resistance changing material into the cavity, and forming a second electrode over the resistance changing material. Forming the heater element includes depositing a third dielectric material over the first electrode, structuring the third dielectric material by means of a line-lithography-process, and depositing the heater material over the third dielectric material. Forming the cavity includes depositing a sacrificial material and structuring the sacrificial material by means of a line-lithography-process.
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