首页>
外国专利>
Die-bonding method of LED chip and LED manufactured by the same
Die-bonding method of LED chip and LED manufactured by the same
展开▼
机译:发光二极管芯片的芯片接合方法及由其制造的发光二极管
展开▼
页面导航
摘要
著录项
相似文献
摘要
A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid-solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time, so as to perform a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110°C, and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200°C.
展开▼