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DOPED AI PASTE FOR LOCAL ALLOYED JUNCTION FORMATION WITH LOW CONTACT RESISTANCE
DOPED AI PASTE FOR LOCAL ALLOYED JUNCTION FORMATION WITH LOW CONTACT RESISTANCE
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机译:掺杂的AI糊剂,用于低接触电阻的局部合金结形成
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摘要
Embodiments of the invention generally relate to solar cells having reduced carrier recombination and methods of forming the same. The solar cells have eutectic local contacts and passivation layers which reduce recombination by facilitating formation of a back surface field (BSF). A patterned aluminum back contact doped with a Group III element is disposed on the passivation layer for removing current form the solar cell. The methods of forming the solar cells include depositing a passivation layer including aluminum oxide and silicon nitride on a back surface of a solar cell, and then forming openings through the passivation layer. An aluminum back contact doped with a Group III element is disposed on the passivation layer in a pattern covering the holes, and thermally processed to form a silicon-aluminum eutectic within the openings.
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