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CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION FOR ARF IMMERSION LITHOGRAPHY AND PATTERN FORMING PROCESS

机译:用于ARF浸没光刻和图案形成过程的化学放大正性抗蚀剂组合物

摘要

PURPOSE: A chemically amplified positive resist composition is provided to minimize the change of a pattern shape due to a liquid exposure by not having a cation eruption. CONSTITUTION: A chemically amplified positive resist composition comprises: 3,3,3-trifluoro-2-hydroxy-2-trifluororomethyl propionic acid sulfonate indicated in chemical formula 1-1; one or more acid generator indicated in chemical formula 1-2; a base resin as an alkali-developing solution-insoluble resin which has an acid functional group protected by an acid-unstable group; and an organic solvent. In the chemical formula 1-1, Ar` can form a ring which is combined with an oxygen atom, methylene group, sulfone group, or carbonyl group and can form a ring which comprises aromatic ring together with a sulfur atom. In chemical formula 1-2, R4 is a C1-30 alkyl group, alkenyl group or aralkyl group, and R5 is a hydrogen atom or trifluoromethyl group.
机译:目的:提供一种化学放大的正性抗蚀剂组合物,以通过使液体不具有阳离子喷出而最小化由于液体暴露而引起的图案形状变化。组成:一种化学放大正型抗蚀剂组合物,包含:化学式1-1所示的3,3,3-三氟-2-羟基-2-三氟罗甲基丙酸磺酸盐;化学式1-2所示的一种或多种产酸剂;作为碱性显影液不溶性树脂的基础树脂,其具有被酸不稳定基团保护的酸官能团;和有机溶剂。在化学式1-1中,Ar'可以形成与氧原子,亚甲基,砜基或羰基结合的环,并且可以形成包含与硫原子一起的芳族环的环。在化学式1-2中,R 4为C 1-30烷基,烯基或芳烷基,并且R 5为氢原子或三氟甲基。

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