WAFER LEVEL PACKAGE WITH IMPROVED YIELD AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A wafer level package and a manufacturing method thereof are provided to improve thermal and physical reliability by using a carbon nanotube with high elasticity to connect a semiconductor chip to a rewiring.;CONSTITUTION: A semiconductor chip(10) includes one surface(10A) and the other surface(10B) facing one surface. A first insulation member(30) is formed on one surface of the semiconductor chip to expose a carbon nanotube(20). The first insulation member includes a first part(31) and a second part(32). A rewiring(40) is electrically connected to the carbon nanotube. A second insulation member(50) is formed on the first insulation member and the rewiring to partially expose the rewiring. An external connection terminal(60) is mounted on the exposed part of the rewiring.;COPYRIGHT KIPO 2013