CHIP STACKING PACKAGE OF A WAFER LEVEL CAPABLE OF IMPROVING THE PRODUCTION YIELD OF A PACKAGE AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A chip stacking package of a wafer level and a manufacturing method thereof are provided to shorten a package assembly time by forming a rewiring line which replaces an under-fill material with copper filler.;CONSTITUTION: A bonding pad is formed in the upper side of a lower chip. The bonding pad is formed in the bottom surface of an upper chip(100). A flip chip(302) interlinks the bonding pad of the upper chip and the bonding pad of the lower chip. An under-fill material(300) is filled in a space between the lower chip and the upper chip. A rewiring line(304) is connected to be conductible to the bonding pad of the outside side of the lower chip.;COPYRIGHT KIPO 2012