首页> 外国专利> METHOD FOR MANUFACTURING WAFER LEVEL PACKAGE TO IMPROVE RELIABILITY AND YIELD OF PACKAGE

METHOD FOR MANUFACTURING WAFER LEVEL PACKAGE TO IMPROVE RELIABILITY AND YIELD OF PACKAGE

机译:制造晶圆级包装以提高包装的可靠性和产量的方法

摘要

PURPOSE: A method for manufacturing a wafer level package is provided to improve reliability and yield of the package by forming a solder ball using electroplating irrespective of the size of the solder ball. CONSTITUTION: The first stress buffer layer(22) is coated on semiconductor chips(21) having bonding pads(21a). By etching the first stress buffer layer, the bonding pads are exposed. A metal seed layer(23) is formed on the exposed bonding pads. A copper line(25) is formed on the metal seed layer by electroplating. A solder ball(27) is formed on the copper line by electroplating. The second stress buffer layer(28) is then formed on the copper line and the first stress buffer layer.
机译:目的:提供一种晶片级封装的制造方法,以通过使用电镀形成锡球来提高封装的可靠性和成品率,而与锡球的尺寸无关。组成:第一应力缓冲层(22)涂覆在具有焊盘(21a)的半导体芯片(21)上。通过蚀刻第一应力缓冲层,暴露出焊盘。在暴露的焊盘上形成金属种子层(23)。通过电镀在金属籽晶层上形成铜线(25)。通过电镀在铜线上形成焊球(27)。然后在铜线和第一应力缓冲层上形成第二应力缓冲层(28)。

著录项

  • 公开/公告号KR20040080601A

    专利类型

  • 公开/公告日2004-09-20

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20030015459

  • 发明设计人 SEO MIN SEOK;

    申请日2003-03-12

  • 分类号H01L21/60;

  • 国家 KR

  • 入库时间 2022-08-21 22:48:02

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