METHOD FOR MANUFACTURING WAFER LEVEL PACKAGE TO IMPROVE RELIABILITY AND YIELD OF PACKAGE

摘要

PURPOSE: A method for manufacturing a wafer level package is provided to improve reliability and yield of the package by forming a solder ball using electroplating irrespective of the size of the solder ball. CONSTITUTION: The first stress buffer layer(22) is coated on semiconductor chips(21) having bonding pads(21a). By etching the first stress buffer layer, the bonding pads are exposed. A metal seed layer(23) is formed on the exposed bonding pads. A copper line(25) is formed on the metal seed layer by electroplating. A solder ball(27) is formed on the copper line by electroplating. The second stress buffer layer(28) is then formed on the copper line and the first stress buffer layer.