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MONITORING FOR EDGE OF WAFER AND ITS MONITORING METHOD
MONITORING FOR EDGE OF WAFER AND ITS MONITORING METHOD
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机译:晶片边缘的监测及其监测方法
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摘要
PURPOSE: An apparatus and method for monitoring foreign materials of a wafer are provided to implement the minimum storage space and the minimum operation quantity by generalizing image data to a binary. CONSTITUTION: An apparatus(100) for monitoring foreign materials of a wafer includes a camera, an image processing unit(10), and a determining unit(20). The camera outputs image data by photographing the wafer. The image processing unit generalizes the image data from the camera to a binary. The determining unit determines normality or abnormality by determining data processed in the image processing unit.
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