首页> 外国专利> TAPE ADHESION DEVICE AND TAPE ADHESION METHOD

TAPE ADHESION DEVICE AND TAPE ADHESION METHOD

机译:胶带粘着装置及胶带粘着方法

摘要

In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge part of a board, an attaching step in which the conductive tape pieces is attached onto the attachment region of a first press position, and a moving step, in which by driving a tape sending mechanism to perform the operation of sending the tape member while a press bonding head and a peeling unit are integrally moved relative to the board, the press bonding head is aligned with the attachment region of a second press position, and a separator is peeled from the tape member attached onto the first press position by the peeling unit during the relative movement, are repeated.
机译:在将带构件切割成导电带片并将导电带片附着到形成在板的侧边缘部分的多个附着区域上的带附着方法中,将导电带片附着到其上的附着步骤第一压制位置的附接区域和移动步骤,其中通过在压接头和剥离单元相对于板整体移动的同时驱动带传送机构以执行传送带构件的操作,压制机接合头与第二按压位置的附接区域对准,并且在相对运动期间,通过剥离单元从附接至第一按压位置的带构件上剥离隔离膜,重复该步骤。

著录项

  • 公开/公告号KR20130029778A

    专利类型

  • 公开/公告日2013-03-25

    原文格式PDF

  • 申请/专利权人 PANASONIC CORPORATION;

    申请/专利号KR20127032863

  • 发明设计人 YAMADA SHINGO;

    申请日2011-06-10

  • 分类号H01R43/00;H05K3/32;G02F1/13;G09F9/00;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:29

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号