PRINTED CIRCUIT BOARD CAPABLE OF PREVENTING THE WARPAGE OF A SUBSTRATE AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent a pad from being damaged due to a polishing operation by polishing a surface before the pad is formed.;CONSTITUTION: A base substrate is prepared(S10). A through hole is formed on the base substrate(S20). A first plating layer is formed on the surface of the base substrate and an inner wall of the through hole(S30). A circuit pattern is formed by opening the first plating layer and a conductive layer(S40). An insulator is filled in the through hole and the opened parts of the first plating layer and the conductive layer(S50). The surface of the first plating layer is polished(S60). A pad electrically connected to the circuit pattern is formed(S70).;COPYRIGHT KIPO 2013;[Reference numerals] (S10) Base substrate preparing step; (S20) Through hole forming step; (S30) First plating layer forming step; (S40) Circuit pattern forming step; (S50) Insulator filling step; (S60) Surface polishing step; (S70) Pad forming step;