METHOD OF FABRICATING PRINTED CIRCUIT BOARD CAPABLE OF IMPROVING SUBSTRATE WARPAGE AND PRINTED CIRCUIT BOARD USING SAME METHOD

摘要

Disclosed is a method of manufacturing a printed circuit board according to one aspect. In the manufacturing method, a carrier substrate is prepared. A first insulating film is formed on the carrier substrate. A second insulating film of a material different from the first insulating film is formed on the first insulating film. On the first insulating film, the second insulating film is patterned to form an insulating pattern layer having a trench. A first circuit pattern layer is formed to fill the trench. An intermediate structure is manufactured by stacking a third insulating film on the first circuit pattern layer and the insulating pattern layer. The carrier substrate is removed from the intermediate structure. In this case, the first insulating film and the third insulating film include the same insulating material and are formed to have the same thickness.;COPYRIGHT KIPO 2019