CARRIER FOR PRINTED CIRCUIT BOARD MANUFACTURING CAPABLE OF IMPROVING PRODUCTIVITY OF PRINTED CIRCUIT BOARDS AND A PRINTED CIRCUIT BOARD MANUFACTURING METHOD USING THE SAME

摘要

PURPOSE: A carrier for printed circuit board manufacturing and a printed circuit board manufacturing method using the same are provided to use the carrier comprised of a dual laminating structure of a metallic foil lamination material, thereby preventing spatial loss and metallic foil abandoned due to adhesive material usage.;CONSTITUTION: A metallic foil lamination material is dually laminated on one surface or rear surface of a junction type insulating layer(110). The metallic foil lamination material is comprised of a first metal layer(120,140) closely laminated on the junction type insulating layer and a second metal layer(130,150) closely laminated on the upper surface of the first metal layer. The first and second metal layers are arranged in a cross-sectional surface or both surface of the junction type insulating layer. The thickness(T1,T3) of the first metal layer is arranged with a structure thicker than the thickness(T2,T4) of the second metal layer.;COPYRIGHT KIPO 2012