SPUTTER APPARATUS CAPABLE OF APPLYING THE HIGH POWER BY IMPROVING THE COOLING EFFICIENCY OF THE SURFACE OF TARGET

摘要

PURPOSE: A sputter apparatus is provided to cool a target by using a target cooling unit that cooling water is circulated in the heat pipe module which is installed in a cathode backing tube, or the cathode backing tube, thereby applying the high power.;CONSTITUTION: A sputter apparatus includes a chamber (100), a rotary cathode (300), and a heat pipe module. The chamber has a deposition space for a substrate. The rotary cathode is rotatably provided in the chamber, and includes a target (310), which provides a deposition material to the substrate, and a cathode backing tube (320) which has the target on the outer wall thereof. The heat pipe module is provided in the cathode backing tube, and cools the target.;COPYRIGHT KIPO 2013