SPUTTER APPARATUS CAPABLE OF APPLYING THE HIGH POWER BY IMPROVING THE COOLING EFFICIENCY OF THE SURFACE OF TARGET

摘要

PURPOSE: A sputter apparatus is provided to cool a target by using a target cooling unit and the cathode backing tube and apply the high power, thereby improving the productivity according to the increase of thin film deposition rate and the quality of deposition.;CONSTITUTION: A sputter apparatus includes a chamber (100), a rotary cathode (300), a target cooling unit, and a heat pipe module. The chamber forms a deposition space for a substrate. The rotary cathode is rotatably provided in the chamber, and includes a target (310), which provides a deposition material to the substrate, a cathode backing tube (320) which has the target on the outer wall thereof, and a magnet unit (330) which is provided in the cathode backing unit. The target cooling unit is provided adjacent to the inner wall of the cathode backing tube, and cools the target by circulating cooling water. The heat pipe module is provided adjacent to the target cooling unit, and cools the target.;COPYRIGHT KIPO 2013