Epoxy resin composition for encapsulating semiconductor element and semiconductor element package using the same

摘要

PURPOSE: An epoxy resin composition for encapsulating a semiconductor element is provided to prevent electric short and/or short circuit by comprising a coloring agent with an excellent insulating property and fluidity, and to improve the moldability in the sealing of the semiconductor device. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor element comprises: titanium nitride black represented by chemical formula 1: TiN_xO_y; epoxy resins; hardeners; curing accelerators; and inorganic fillers. The titanium nitride black is coated with a phenol resin. In chemical formula 1, x is 0.01~3 and y is 1.5~10. The titanium nitride black coated with the phenol resin includes the titanium nitride black and the phenol resin in a weight ratio of 1~30 : 99~70.