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Method for Manufacturing Thin Film Transistor of Poly Silicon Having Cu Bottom Gate Structure of Trench Type

机译:具有沟槽型Cu底栅结构的多晶硅薄膜晶体管的制造方法

摘要

This invention is a polysilicon thin film transistor having a bottom gate structure and a process for producing the shape of the trench using a copper relates to a method . The present invention is a transparent insulating substrate ; The formation of a transparent insulating pattern corresponding to the pattern on the substrate and gate oxide patterns are used to form the gate electrode ; The trench having a trench -shaped guide portion which contact window exposes the top of the seed pattern; A gate electrode formed in the trench on the exposed copper seed pattern is electrodeposited ; The gate electrode and gate insulating film formed on a trench -shaped guide portion thereon; And a channel region, a source region and a drain region formed in the polysilicon layer that is on top of the gate insulating film . ;
机译:本发明是一种具有底栅结构的多晶硅薄膜晶体管和利用铜产生沟槽形状的方法。本发明是透明的绝缘基板。形成与基板上的图案对应的透明绝缘图案和栅氧化物图案以形成栅电极;该沟槽具有与沟槽接触的沟槽形引导部分,该沟槽暴露出籽晶图案的顶部。电沉积形成在暴露的铜籽晶图案上的沟槽中的栅电极;栅电极和栅绝缘膜形成在其上的沟槽形引导部分上;以及在栅极绝缘膜顶部上的多晶硅层中形成的沟道区,源极区和漏极区。 ;

著录项

  • 公开/公告号KR101283008B1

    专利类型

  • 公开/公告日2013-07-05

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20100133127

  • 发明设计人 주승기;

    申请日2010-12-23

  • 分类号H01L29/786;G02F1/136;

  • 国家 KR

  • 入库时间 2022-08-21 16:24:52

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